C. Shuting, Y. N. Hua, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore

Summary: In this work, we show a pFET failure caused by inappropriate bond pad/bond wire size as well as electrostatic damage during wire bonding. Based on the failure symptom and the lab experimental works, a possible failure mechanism of the high gate leakage and the bondpad design rule & bonding conditions will be proposed & discussed.