A. Mizoguchi, M. Sugawara, M. Nakamura, K. Takeuchi, Mitsubishi Electric Co., Kamakura, Japan

Summary: We discussed the effectiveness of X-ray CT images for the some failure analyses in last year (ISTFA2009). This abstract which is continued to this discusses new example of some applications of X-ray CT images in the failure analysis and the reliability evaluation. Especially, we are going to discuss the result of the investigation for the crack progress generated in the solder joints in the heat cycle test. These studies of the crack progress generated in the solder joints are implemented by the X-ray CT images as the nondestructive analysis technique. We think that the X-ray CT images as the nondestructive analysis technique will be more important technique than DPA in future.