F. Altmann, J. Schischka, Fraunhofer Institute for Mechanics of Materials, Halle, Germany; R. Lehmann, FEI Deutschland GmbH, Frankfurt / Main, Germany; L. F. T. Kwakmann, FEI Europe B.V., Eindhoven, Netherlands; V. V. Ngo, S. Stone, FEI Company, Hillsboro, OR

Summary: In this work EBIC/FIB applications for characterization and failure analysis of different thin film technologies were evaluated on the Quanta 3D FEG dualbeam system. EBIC investigations of the surface and on FIB cross-sections have been applied on different thin film technologies to study the location of the p-n junction in relation to topography and grain structure. Depth and dimension of the depletion zone was visualized and compared for different samples from the production line. Additionally combined EBIC/FIB method has been used for localization and characterization of electrical active defects.