ISTFA Home   •   Exposition   •   To Register   •   ASM Homepage
Back to "Symposium Opening/Awards Presentation/Keynote Speaker/IPFA 2010 Best Paper Award/TCP Introduction" Search
  Back to "Symposium" Search  Back to Main Search

Tuesday, November 16, 2010 - 8:00 AM
.1

Combining High-Resolution Pulsed TIVA and Nanoprobing Techniques to Identify Drive Strength Issues in Mixed-signal Circuits

V. Ravikumar, M. Y. Ho, S. L. Phoa, V. Narang, J. M. Chin, Advanced Micro Devices - Singapore Pte Ltd1, Singapore, Singapore; R. R. Goruganthu, Advanced Micro Devices Inc., Austin, TX

View in WORD format

Summary: Abstract - This paper uses an interesting case study to highlight high-resolution pulsed thermal-induced voltage alteration (TIVA) with solid immersion lens (SIL) as a technique to isolate a temperature-sensitive failure in mixed-signal circuitry, followed by circuit analysis and nanoprobing to confirm a drive strength issue caused by a process change.