A. G. Street
inscopelabs
Singapore
Session 11: Posters
 

A. Riley
Multiprobe Inc
Santa Barbara, CA
Session 18: Nanoprobing and Nano Scale Electronic Characterization
 

A. Mulay
Texas Instruments
TX
Session 9: Board and System Level FA
 

B. Holdford
Texas Instruments
Dallas, TX
Session 6: Sample Prep for Chip Access and Device Deprocessing
Session 8: Sample Prep for Chip Access and Device Deprocessing 2
 

B. P. Sood
CALCE, University of Maryland
College Park, MD
Session 16: Counterfeit Electronics – Risks and Mitigation
 

C. Boye
IBM
Albany, NY
Session 20: Packaging and Assembly Level FA II
 

D. Vallett
IBM
Burlington, VT
Session 1: Emerging FA Techniques and Concepts
 

D. L. Burgess
Accelerated Analysis
Half Moon Bay, CA
Session 12: MEMS, Discretes and Optoelectronic Device FA
 

D. W. Niles
Avago Technologies
Fort Collins, CO
Session 7: Alternative Energy (Photovoltaics, Solid State Lighting, etc.)
 

F. Beaudoin
IBM
Hopewell Junction, NY
Session 10: Photon Based Techniques I
 

G. Shade
Insight Analytical Labs
Colorado Springs, CO
Session 16: Counterfeit Electronics – Risks and Mitigation
 

G. Eide
Mentor Graphics
Wilsonville, OR
Session 14: Test and Diagnostic, Test and Debug
 

H. Deslandes
DCG Systems
Fremont, CA
Session 10: Photon Based Techniques I
 

J. J. Demarest
IBM
Albany, NY
Session 3: Packaging and Assembly Level FA I
Session 20: Packaging and Assembly Level FA II
 

J. T. Cargo
LSI Corporation
Allentown, PA
Session 4: Sample Preparation for Technological Analysis
 

J. Colvin
FA Instruments
San Jose, CA
Session 12: MEMS, Discretes and Optoelectronic Device FA
 

K. (. Hooghan
FEI KAUST
Saudi Arabia
Session 4: Sample Preparation for Technological Analysis
 

L. G. Henry
ESD-TLP Consulting & Testing
Fremont,, CA
Session 2: FA Process/Case Studies
 

M. E. Kimball
Maxim Integrated Products, Inc.
Hillsboro, OR
Session 14: Test and Diagnostic, Test and Debug
 

M. Versen
University of Applied Sciences Rosenheim
Rosenheim, Germany
Session 11: Posters
 

M. W. Phaneuf
Fibics Incorporated
Ottawa, ON, Canada
Session 19: Circuit Edit II (Laser, FIB, etc.)
Session 15: Cicuit Edit I
 

M. Bruce
Independent Consultant
TX
Session 1: Emerging FA Techniques and Concepts
 

O. Breitenstein
Max Planck Institute of Microstructure Physics
Halle, Germany
Session 7: Alternative Energy (Photovoltaics, Solid State Lighting, etc.)
 

P. Kaszuba
IBM Microelectronics
Essex Junction, VT
Session 5: Defect Characterization & Metrology - I
Session 13: Defect Characterization & Metrology - II
 

R. A. Falk
Quantum Focus Instruments
Tukwila, WA
Session 17: Photon Based Techniques II
 

R. Champaign
Raytheon Network Centric Systems
McKinney, TX
Session 6: Sample Prep for Chip Access and Device Deprocessing
Session 8: Sample Prep for Chip Access and Device Deprocessing 2
 

R. Steirman
Omniprobe
TX
Session 9: Board and System Level FA
 

R. Ring
SMSC Austin
Austin, TX
Session 2: FA Process/Case Studies
 

T. Cavanah
DCG Systems, Inc
TX
Session 18: Nanoprobing and Nano Scale Electronic Characterization
 

T. R. Lundquist
DCG Systems, Inc
Freemont, CA
Session 19: Circuit Edit II (Laser, FIB, etc.)
Session 15: Cicuit Edit I
 

T. Kane
IBM
Hopewell Junction, NY
Session 5: Defect Characterization & Metrology - I
 

T. Kane
IBM
Hopewell Junction, NY
Session 13: Defect Characterization & Metrology - II
 

W. Scott
Evans Analytical Group
Irvine, CA
Session 17: Photon Based Techniques II