45th International Symposium for Testing and Failure Analysis (Nov. 10-14, 2019):

45th International Symposium for Testing and Failure Analysis (Nov. 10-14, 2019)
November 10 - 14, 2019

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Dr. Kristof J.P. Jacobs

Research scientist
Imec
Leuven Belgium 3001

Papers:

Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing

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General Information

November 10 - 14, 2019


Portland, OR