45th International Symposium for Testing and Failure Analysis (Nov. 10-14, 2019): At-A-Glance
45th International Symposium for Testing and Failure Analysis (Nov. 10-14, 2019): At-A-Glance
SUNDAY November 10
Tutorial
AM
-
Electrical and Yield8:00 AM-11:50 AM
-
Package and Physical Analysis Challenges8:00 AM-11:50 AM
-
Fault Isolation8:00 AM-2:00 PM
PM
-
Featured Talk12:30 PM-5:20 PM
-
Microscopy12:30 PM-5:20 PM
-
Package and Physical Analysis Challenges II2:20 PM-4:20 PM
MONDAY November 11
Technical Program
AM
-
Opening Session/EDFAS General Meeting7:45 AM-10:00 AM
-
Morning Refreshment Break10:00 AM-10:20 AM
-
Emerging FA Techniques10:20 AM-12:00 PM
PM
-
Sample Preparation User Group12:00 PM-2:00 PM
-
System on Package User Group12:00 PM-2:00 PM
-
3D Device Failure Analysis2:00 PM-2:50 PM
-
FIB Circuit Analysis and Edit2:00 PM-2:50 PM
-
Afternoon Refreshment Break2:50 PM-3:10 PM
-
3D Device Failure Analysis II3:10 PM-4:50 PM
-
Microscopy3:10 PM-4:50 PM
-
Tools of the Trade Tour - Pre Registration is Required5:00 PM-6:50 PM
-
Evening Social Event at the Punch Bowl7:00 PM-10:00 PM
TUESDAY November 12
Technical Program
AM
-
Morning Refreshment Break9:30 AM-10:10 AM
-
Nanoprobing and Electrical Characterization11:10 AM-11:35 AM
-
Detecting and Preventing Counterfeit Microelectronics11:40 AM-12:05 PM
PM
-
Lunch on the Expo Show Floor12:00 PM-1:00 PM
-
FIB Sample Preparation1:00 PM-2:40 PM
-
Nanoprobing and Electrical Characterization II1:00 PM-2:40 PM
-
Afternoon Refreshment Break2:40 PM-3:20 PM
-
Nanoprobing and Electrical Characterization III3:20 PM-4:35 PM
-
FIB Sample Preparation II3:20 PM-5:00 PM
-
Reception on the Expo Show Floor5:00 PM-6:30 PM
Tutorial
AM
-
Electrical and Yield II10:10 AM-11:10 AM
-
Microscopy II10:10 AM-11:40 AM
WEDNESDAY November 13
Technical Program
AM
-
Packaging & Assembly8:00 AM-9:40 AM
-
Space Application FA and Energy9:00 AM-9:25 AM
-
SI Photonic FA9:25 AM-9:50 AM
-
Morning Refreshment Break9:40 AM-10:10 AM
-
Lunch on the Expo Show Floor11:40 AM-1:40 PM
PM
-
Fault Isolation1:40 PM-2:30 PM
-
Hardware Attacks, Security, and Reverse Engineering1:40 PM-2:30 PM
-
3D Device Failure Analysis - POSTER2:30 PM-4:30 PM
-
Emerging FA Techniques - POSTER2:30 PM-4:30 PM
-
FA Processes Case Studies - POSTERS2:30 PM-4:30 PM
-
Fault Isolation - POSTERS2:30 PM-4:30 PM
-
Microscopy - POSTERS2:30 PM-4:30 PM
-
Mixed Mode & High Power Devices Case Studies - POSTERS2:30 PM-4:30 PM
-
Nanoprobing and Electrical Characterization - POSTERS2:30 PM-4:30 PM
-
Packaging & Assembly - POSTERS2:30 PM-4:30 PM
-
Poster and Video Dessert Reception 2:30 - 4:30 PM2:30 PM-4:30 PM
-
Product Yield, Test & Diagnostics - POSTERS2:30 PM-4:30 PM
-
Sample Preparation and Device Deprocessing - POSTERS2:30 PM-4:30 PM
-
Scanning Probing Analysis - POSTERS2:30 PM-4:30 PM
-
Space Application and Energy - POSTERS2:30 PM-4:30 PM
-
Board and System Level FA4:30 PM-5:20 PM
-
Fault Isolation II4:30 PM-5:45 PM
Tutorial
AM
-
Featured Talk II8:00 AM-9:00 AM
THURSDAY November 14
Technical Program
AM
-
Sample Preparation and Device Deprocessing8:00 AM-10:05 AM
-
FA Processes Case Studies9:25 AM-9:50 AM
-
Morning Refreshment Break10:05 AM-10:25 AM
-
FA Processes Case Studies II10:25 AM-12:05 PM
-
Scanning Probe Analysis10:25 AM-12:05 PM
PM
-
Lunch/Contactless Probing and Nanoprobing User Group12:05 PM-2:05 PM
-
Lunch/FIB User Group12:05 PM-2:05 PM
-
Low Power Devices Case Studies2:05 PM-2:55 PM
-
Product Yield, Test & Diagnostics2:30 PM-4:10 PM
-
Mixed Mode & High Power Devices Case Studies2:55 PM-3:45 PM
Tutorial
AM
-
Microscopy III8:00 AM-9:00 AM