“FAILURE ANALYSIS ON BGA U45 ON SOLDERED BALLS”

Monday, December 7, 2020: 3:30 PM
Dr. Miguel Angel Neri-Flores, Researcher , Advanced Materials Research Center (CIMAV), Chihuahua, Mexico
Mr. Gregorio Vazquez-Olvera , Advanced Materials Research Center (CIMAV), Chihuahua, Mexico

Summary:

One Printed circuit board with soldered components was analyzed on the BGA U45, to determine the failure on the soldered balls, using Metallographic analysis, Scanning Electron Microscopy and X ray computed Tomography.
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