AI-driven Advancements in Image Processing, Analysis and 3D Modeling for Fault Isolation and Failure Analysis
AI-driven Advancements in Image Processing, Analysis and 3D Modeling for Fault Isolation and Failure Analysis
Monday, October 28, 2024: 10:20 AM
202 (Hilton San Diego Bayfront)
Summary:
Complex failure mechanisms and defect sites often cannot be observed in simple 2D images, thus neutralizing the efforts of failure analysis and process engineers. Working with three-dimensional (3D) datasets offers several advantages over two-dimensional (2D) images, as they enhance comprehensive visualization, spatial understanding, quantitative and statistical analysis through the application of advanced 3D modeling and image processing techniques. The ability to handle and manipulate 3D datasets is crucial for taking full advantage of the 3D approach and to contribute to more effective and precise analysis of electronic samples, ultimately leading to improved device reliability and performance. In this tutorial, we will explore the intersection of artificial intelligence (AI) and semiconductor technology, focusing on enhancing fault isolation and failure analysis through advanced 3D modeling and image processing techniques. The tutorial will provide comprehensive explanation on working with three-dimensional datasets obtained from cutting-edge imaging technologies, such as X-ray microscopy (XRM) and focused-ion beam scanning electron microscopy (FIB-SEM) tomography. Moreover, innovative protocols, routines, and workflows for integrating information in a multimodal and multiscale environment, specifically developed by the authors for this training, will be provided. Participants will gain an understanding of the fundamental procedures for 3D dataset reconstruction and visualization, as well as image processing techniques including filtering, segmentation, object analysis, and 3D modeling within the context of semiconductor technology. The tutorial will focus on the discussion of the limits of traditional image processing methods and introduce AI solutions to overcome these challenges and provide practical examples and workflows. By leveraging AI-driven approaches, participants will learn how to optimize fault isolation and failure analysis processes, ultimately advancing the capabilities of semiconductor technology in addressing critical challenges and improving device reliability. The authors will provide the audience with fundamental knowledge required to enter the field, as well as the tools to begin working with 3D datasets and apply advanced AI-based solutions for high-level image analysis purposes.
Complex failure mechanisms and defect sites often cannot be observed in simple 2D images, thus neutralizing the efforts of failure analysis and process engineers. Working with three-dimensional (3D) datasets offers several advantages over two-dimensional (2D) images, as they enhance comprehensive visualization, spatial understanding, quantitative and statistical analysis through the application of advanced 3D modeling and image processing techniques. The ability to handle and manipulate 3D datasets is crucial for taking full advantage of the 3D approach and to contribute to more effective and precise analysis of electronic samples, ultimately leading to improved device reliability and performance. In this tutorial, we will explore the intersection of artificial intelligence (AI) and semiconductor technology, focusing on enhancing fault isolation and failure analysis through advanced 3D modeling and image processing techniques. The tutorial will provide comprehensive explanation on working with three-dimensional datasets obtained from cutting-edge imaging technologies, such as X-ray microscopy (XRM) and focused-ion beam scanning electron microscopy (FIB-SEM) tomography. Moreover, innovative protocols, routines, and workflows for integrating information in a multimodal and multiscale environment, specifically developed by the authors for this training, will be provided. Participants will gain an understanding of the fundamental procedures for 3D dataset reconstruction and visualization, as well as image processing techniques including filtering, segmentation, object analysis, and 3D modeling within the context of semiconductor technology. The tutorial will focus on the discussion of the limits of traditional image processing methods and introduce AI solutions to overcome these challenges and provide practical examples and workflows. By leveraging AI-driven approaches, participants will learn how to optimize fault isolation and failure analysis processes, ultimately advancing the capabilities of semiconductor technology in addressing critical challenges and improving device reliability. The authors will provide the audience with fundamental knowledge required to enter the field, as well as the tools to begin working with 3D datasets and apply advanced AI-based solutions for high-level image analysis purposes.