50th International Symposium for Testing and Failure Analysis (October 28- November 1, 2024): At-A-Glance
50th International Symposium for Testing and Failure Analysis (October 28- November 1, 2024): At-A-Glance
SUNDAY October 27
Technical Program
AM
PM
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Registration Open5:00 PM-7:00 PM
MONDAY October 28
Technical Program
AM
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Monday's Author's Coffee/Briefing7:00 AM-8:00 AM
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Registration Open7:00 AM-5:00 PM
Tutorial
AM
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Fault Isolation I8:00 AM-9:00 AM
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Package and Physical Analysis Challenges I8:00 AM-9:00 AM
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Microscopy I8:00 AM-10:00 AM
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Fault Isolation II9:00 AM-10:00 AM
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Technology Specific and Featured Topics I9:00 AM-10:00 AM
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Morning Refreshment Break10:00 AM-10:20 AM
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Fault Isolation III10:20 AM-12:20 PM
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Microscopy II10:20 AM-12:20 PM
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Technology Specific and Featured Topics II10:20 AM-12:20 PM
PM
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Monday's Lunch12:20 PM-1:20 PM
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Fault Isolation IV1:20 PM-2:20 PM
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Electrical and Yield I1:20 PM-3:20 PM
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Microscopy III1:20 PM-3:20 PM
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Package and Physical Analysis Challenges II2:20 PM-3:20 PM
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Afternoon Refreshment Break3:30 PM-3:50 PM
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Electrical and Yield II3:50 PM-4:50 PM
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Microscopy IV3:50 PM-4:50 PM
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Package and Physical Analysis Challenges III3:50 PM-4:50 PM
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Fault Isolation V4:50 PM-5:50 PM
TUESDAY October 29
Technical Program
AM
-
Continental Breakfast7:00 AM-7:45 AM
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Tuesday's Authors Coffee/Briefing7:00 AM-8:00 AM
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Registration Open7:00 AM-5:00 PM
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Opening Session & EDFAS General Membership Meeting8:00 AM-9:45 AM
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Tuesday Morning Refreshment Break9:45 AM-10:00 AM
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FA Roadmap Session10:45 AM-12:15 PM
PM
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Tuesday's Lunch12:15 PM-1:20 PM
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Case Studies: FA Process and workflows1:20 PM-2:50 PM
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Emerging FA Techniques and Concepts I1:20 PM-2:50 PM
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Power Devices (Si, SiC, GaN)1:20 PM-2:50 PM
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Tuesday Afternoon Refreshment Break2:40 PM-3:00 PM
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Emerging FA Techniques and Concepts II3:00 PM-4:20 PM
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Sample Preparation and Device De-processing3:00 PM-4:20 PM
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Tools of the Trade Tour4:45 PM-6:15 PM
WEDNESDAY October 30
Student Poster Contest
PM
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Student Poster Session1:30 PM-3:30 PM
Technical Program
AM
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Wednesday's Author Coffee/Briefing7:00 AM-8:00 AM
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Registration Open7:30 AM-5:30 PM
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Wednesday Morning Refreshment Break9:30 AM-10:00 AM
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Exhibit Hall Open9:30 AM-6:00 PM
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FIB Circuit Edit10:00 AM-10:20 AM
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OFI/Test/Diagnosis User Group Discussion10:00 AM-11:20 AM
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Package Level Fault Isolation10:00 AM-11:20 AM
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FIB Sample Preparation10:20 AM-12:00 PM
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Die Level Fault Isolation11:20 AM-12:00 PM
PM
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Wednesday's Lunch12:00 PM-1:00 PM
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Nanoprobing/Scanning Probe User Group Discussion1:00 PM-2:00 PM
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Product Yield, Test and Diagnostics1:40 PM-2:00 PM
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Boards and Systems1:40 PM-2:40 PM
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Hardware Security & Counterfeiting2:00 PM-2:40 PM
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Wednesday Afternoon Refreshment Break2:40 PM-3:00 PM
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Scanning Probe Analysis3:00 PM-4:00 PM
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Focused Ion Beam User Group Discussion3:00 PM-4:40 PM
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50 Years of Innovation Exhibitor Reception4:30 PM-6:00 PM
Tutorial
PM
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Electrical and Yield III3:40 PM-4:40 PM
THURSDAY October 31
Technical Program
AM
-
Thursday's Author Coffee/Briefing7:00 AM-8:00 AM
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Registration Open7:30 AM-6:30 PM
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Case Studies: Device Analysis8:00 AM-9:00 AM
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Sample Preparation User Group Discussion8:00 AM-9:00 AM
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AI Applications for Failure Analysis8:00 AM-9:40 AM
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Exhibit Hall Open9:30 AM-4:00 PM
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Thursday Morning Refreshment Break9:40 AM-10:00 AM
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Microscopy Analysis and Material Characterization10:00 AM-11:20 AM
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Artificial Intelligence User Group Discussion10:00 AM-11:40 AM
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Thursday's Lunch11:40 AM-1:00 PM
PM
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Women in Electronics Failure Analysis (WEFA)12:00 PM-1:00 PM
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ISTFA Turns 50: Sweetening the Celebration2:30 PM-3:45 PM
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Poster Session2:30 PM-3:45 PM
Tutorial
PM
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Package and Physical Analysis Challenges IV3:45 PM-4:45 PM
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Technology Specific and Featured Topics III3:45 PM-4:45 PM
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Technology Specific and Featured Topics IV3:45 PM-4:45 PM
FRIDAY November 1
Technical Program
AM
-
Friday's Author Coffee/Briefing7:00 AM-8:00 AM
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Registration Open7:30 AM-11:00 AM
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System in Package and 3D Devices8:00 AM-9:40 AM
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Nanoprobing, Electrical Characterization I8:00 AM-10:00 AM
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System in Package (SiP) User Group Discussion9:40 AM-10:40 AM