LADA and SDL: Powerful Techniques for Marginal Failures

Sunday, October 4, 2026: 3:50 PM
205 (Henry B. González Convention Center)
Mr. Dan Bodoh , NXP Semiconductors, Austin, TX
Ms. Amrutha Sampath , NXP Semiconductors, Austin, TX

Summary:

This presentation is an application-oriented tutorial on laser-assisted device alteration (LADA) and soft defect localization (SDL) techniques and how they are used to analyze marginal digital failures and identify analog circuits that are sensitive to voltage perturbations. The presentation includes well-illustrated instructions for equipment setup and validation, guidelines for collecting and analyzing images, and examples of how to interpret pass/fail sites and assess the effect of laser interactions on circuit behaviors. It also includes a brief overview of time-resolved LADA.
See more of: Fault Isolation III
See more of: Tutorial