52nd International Symposium for Testing and Failure Analysis (October 4-8, 2026): At-A-Glance
52nd International Symposium for Testing and Failure Analysis (October 4-8, 2026): At-A-Glance
SATURDAY October 3
Technical Program
AM
PM
SUNDAY October 4
Technical Program
AM
-
Author's Coffee7:00 AM-8:00 AM
-
Morning Refreshment Break10:00 AM-10:20 AM
PM
-
Lunch12:20 PM-1:30 PM
-
Afternoon Refreshment Break3:30 PM-3:50 PM
Tutorial
AM
-
Tutorial Program Opening7:50 AM-8:00 AM
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Microscopy I8:00 AM-10:00 AM
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Package Analysis8:00 AM-10:00 AM
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Technology Specific and Featured Topics I8:00 AM-10:00 AM
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Microscopy II10:20 AM-11:20 AM
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Technology Specific and Featured Topics II10:20 AM-11:20 AM
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Electrical & Yield I10:20 AM-12:20 PM
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Fault Isolation I11:20 AM-12:20 PM
PM
-
Electrical & Yield II1:30 PM-3:30 PM
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Fault Isolation II1:30 PM-3:30 PM
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Microscopy III1:30 PM-3:30 PM
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Fault Isolation III3:50 PM-5:50 PM
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Microscopy IV3:50 PM-5:50 PM
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Microscopy V3:50 PM-5:50 PM
MONDAY October 5
Technical Program
AM
-
Author's Coffee7:00 AM-8:00 AM
-
Breakfast7:30 AM-8:30 AM
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Opening Session & EDFAS General Meeting8:30 AM-9:40 AM
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Best Paper Awards9:40 AM-10:30 AM
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Morning Refreshment Break10:30 AM-10:50 AM
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Emerging FA Techniques and Concepts10:50 AM-12:30 PM
PM
-
Lunch12:30 PM-1:40 PM
-
Women in Failure Analysis12:30 PM-1:40 PM
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IRFA Keynote1:40 PM-3:10 PM
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Afternoon Refreshment Break3:10 PM-3:30 PM
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IRFA Isolation Brainstorming3:30 PM-4:00 PM
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IRFA Package Brainstorming3:30 PM-4:00 PM
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IRFA Post Isolation Brainstorming3:30 PM-4:00 PM
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Integrated PFA User Group Discussion4:00 PM-5:00 PM
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OFI User Group Discussion4:00 PM-5:00 PM
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System in Package User Group Discussion4:00 PM-5:00 PM
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User Group Discussion Break5:00 PM-5:15 PM
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Tools of the Trade Tour5:30 PM-7:30 PM
TUESDAY October 6
Technical Program
AM
-
Author's Coffee7:00 AM-8:00 AM
-
ISTFA Keynote8:30 AM-9:30 AM
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Morning Refreshment Break9:30 AM-10:10 AM
-
Exhibit Open Hours9:30 AM-6:00 PM
-
AI Applications for Failure Analysis I10:10 AM-11:00 AM
-
Design for Analysis, Test and Diagnostics10:10 AM-11:00 AM
-
Nanoprobing & Electrical Characterization10:10 AM-11:00 AM
PM
-
Sample Prep User Group Discussion12:50 PM-1:50 PM
-
AI Applications for Failure Analysis II12:50 PM-2:50 PM
-
Device Analysis - Case Studies I12:50 PM-2:50 PM
-
FIB User Group Discussion1:50 PM-2:50 PM
-
Afternoon Refreshment Break2:50 PM-3:20 PM
-
Device Analysis - Case Studies II3:20 PM-3:40 PM
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AI Applications for Failure Analysis III3:20 PM-4:00 PM
-
Scanning Probe Analysis3:20 PM-5:00 PM
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More than Moore: Integrating New Functions into Nano-Electronics3:40 PM-4:00 PM
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AI User Group Discussion4:00 PM-5:00 PM
-
Welcome Reception with the Exhibitors5:00 PM-6:30 PM
Tutorial
PM
-
Fault Isolation IV4:00 PM-5:00 PM
WEDNESDAY October 7
Student Poster Contest
PM
-
Student Poster Contest3:00 PM-4:00 PM
Technical Program
AM
-
Author's Coffee7:00 AM-8:00 AM
-
Die Level Fault Isolation I8:00 AM-9:40 AM
-
FA Process: Fault Isolation, Mechanisms & Solutions I8:00 AM-9:40 AM
-
Package Level Fault Isolation I9:00 AM-9:40 AM
-
Exhibit Open Hours9:00 AM-4:00 PM
-
Morning Refreshment Break9:40 AM-10:00 AM
-
Die Level Fault Isolation II10:00 AM-10:20 AM
-
FA Process: Fault Isolation, Mechanisms & Solutions II10:00 AM-11:40 AM
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Package Level Fault Isolation II10:00 AM-11:40 AM
-
Nanoprobing/SPM User Group Discussion10:40 AM-11:40 AM
-
Capital Equipment Forum11:40 AM-1:10 PM
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Lunch on the Expo Floor11:40 AM-1:10 PM
-
Student Young Professionals11:40 AM-1:10 PM
PM
-
Afternoon Refreshment Break1:10 PM-1:30 PM
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Panel Discussion1:30 PM-3:00 PM
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Poster Session3:00 PM-4:00 PM
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FA at the Next Level, Boards and Systems4:00 PM-4:20 PM
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Hardware Security and Counterfeiting4:00 PM-5:20 PM
-
Power Devices (Si, SiC, GaN)4:20 PM-5:00 PM
-
Student Young Professionals Discussion5:00 PM-5:30 PM
-
Social Networking Event7:00 PM-9:30 PM
Tutorial
AM
-
Fault Isolation V8:00 AM-9:00 AM
PM
-
Technology Specific and Featured Topics III4:00 PM-5:00 PM
THURSDAY October 8
Technical Program
AM
-
Author's Coffee7:00 AM-8:00 AM
-
Microscopy Analysis and Material Characterization I8:00 AM-10:00 AM
-
Sample Preparation and Device De-processing8:00 AM-10:20 AM
-
Morning Refreshment Break10:00 AM-10:20 AM
-
Microscopy Analysis and Material Characterization II10:20 AM-11:20 AM
-
FIB Sample Preparation & Circuit Edit10:20 AM-12:00 PM
-
System in Package and 3D Devices10:20 AM-12:20 PM
Tutorial
AM
-
Fault Isolation VI8:00 AM-9:00 AM
-
Technology Specific and Featured Topics IV9:00 AM-10:00 AM