Direct Write of Antenna Aperstructures and Electronic Interconnects Using Kinetic MetallizationTM

Inovati has been developing a direct write method of fabricating metallic antenna structures onto doubly curved dielectric surfaces using the low temperaure Kinetic Metallization^TM process. This technology will enable fabrication of low profile RF systems on current and planned airborne platforms including unmanned aerial vehicles. Low profile antenna are achieved through integration with structural elemets referred to as aperstructures. The KM process offers the potential to enable fabrication of aperstructures onto complex shaped dielectric surfaces as no other technology can. Targeted markets in the wireless military and commercial communication industry have already been identified with primary customers interested in the manufacture of large scale antenna systems. Additionally, the direct write process is expected to find application in the electronics industry for depositing interconnects, lead frames, and other electronic structures that are difficult to deposit with vacuum or chemical processes. Results obtained to date with deposition of copper and silver antenna elements onto doubly-curved polymeric and ceramic dielectric surfaces will be presented along with RF performance testing of antenna structures.