International Thermal Spray Conference (ITSC) 2009 (May 4-7, 2009): Thermal Spray Metallic Coatings for Use in Semiconductor Defect Reduction and Electronic Interconnects

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Thermal Spray Metallic Coatings for Use in Semiconductor Defect Reduction and Electronic Interconnects

Tuesday, May 5, 2009: 3:40 PM-5:00 PM
Laughlin III (Flamingo Las Vegas Hotel)
Session Chair:
Dr. Robert Gansert
3:40 PM
Defect Reduction in Semiconductor Equipment by Thermal Spray
Dr. Hougong Wang, Applied Materials Inc
4:00 PM
Parameters Affecting Bond Strength and Surface Roughness in Twin Wire Arc Spray Aluminum Coatings
Mr. Matthew Watson, HFW Industries Incorporated; Dr. Robert Gansert, AMTS Incorporated
4:20 PM
Influence of Powder Size in Aluminum Oxide Coatings for Use in the Semiconductor Industry
Mr. Albert Sickinger, HAI Advanced Materials Specialists, Inc.
4:40 PM
Direct Write of Antenna Aperstructures and Electronic Interconnects Using Kinetic MetallizationTM
Dr. Ralph Tapphorn, Inovati; Jeffrey A. Henness, Inovati; Howard Gabel, Inovati
See more of: Electronic and Semiconductor Applications
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