International Thermal Spray Conference (ITSC) 2009 (May 4-7, 2009): Influence of Powder Size in Aluminum Oxide Coatings for Use in the Semiconductor Industry

Influence of Powder Size in Aluminum Oxide Coatings for Use in the Semiconductor Industry

Tuesday, May 5, 2009: 4:20 PM

Laughlin III (Flamingo Las Vegas Hotel)

Mr. Albert Sickinger , HAI Advanced Materials Specialists, Inc., Placentia, CA

NA

See more of: Thermal Spray Metallic Coatings for Use in Semiconductor Defect Reduction and Electronic Interconnects
See more of: Electronic and Semiconductor Applications