Thermal Spray Coatings Considerations in the Semiconductor Equipment Design and Chamber Operation

Thermal spray coatings are used in a broad range of applications in the semiconductor equipment.  Thermal spray metallic coatings use includes particle reduction and contamination control in process chamber operations during thin film deposition.   Thermal-sprayed ceramic coatings are used in semiconductor equipment for desired dielectric properties, for chemical and corrosion-resistance for components, and for a range of other purposes.  This paper will review the need for coatings in the semiconductor equipment for the future as well as the coating challenges of today.  Areas to be discussed may include coating design considerations for application to semiconductor chamber operations; chemical, corrosion and erosion issues influencing the selection of materials, coatings and processes, or standards (or standard of practice) for materials, processing, finishing and cleaning involved in the utilization of coatings.  A brief discussion will be provided for future anticipated needs in materials, coatings, processing and the manufacture of thermal spray coatings for such applications.