Molecular Dynamics Simulation of Nano-scale Ceramic Particle Connection Derived by High Velocity Collision

Nanoscale ceramic particle connection plays an important role in determining the properties of particle-formed materials. Compared to metal materials, nano-scale ceramic materials exhibit dramatically different deformation behavior from their bulk counterparts. Although the deposition occurs at room temperature, there is a challenge for investigating the mechanism of nanoscale inter-particle bonding for high velocity collision. To understand it, molecular dynamics (MD) simulation was performed under different collision conditions. Results showed that the particle connection ratio was improved by increasing particle velocity, which is not so significant, and temperature during collision. Meanwhile, impact pressure was improved by increasing the particle velocity. By illuminating the particle collision process, it clearly demonstrates that the bonding of nano-sized ceramic particles at high velocity collision was attributed to a localized deformation at the compacting region with the atoms displacement.