Sn-(3.0~4.0)Ag-(0.5~0.7)Cu alloys have been recognized as popular solders for the replacement of lead bearing alloy in reflow soldering. Sn-0.7Cu with little alloying additives has also been proposed as a good lead-free candidate for wave soldering. However, both of them have some disadvantages: the Sn-(3.0~4.0)Ag-(0.5~0.7)Cu alloys are expensive for cost sensitive products; and the Sn-0.7Cu alloy has a high melting point that can cause thermal damage to electronic devices. The Sn-0.8Cu-1.8Bi-0.6In alloy was developed to address these issues. In this study, the wetting properties of the Sn-0.8Cu-1.8Bi-0.6In alloy were evaluated, and the characteristics of its reflow-soldered joint were estimated. Experimental results showed that around 250°C the Sn-0.8Cu-1.8Bi-0.6In alloy had wetting properties equal to Sn3.5Ag0.7Cu and better than that of Sn-0.7Cu. Sn-0.8Cu-1.8Bi-0.6In solder bumps with a height of 260µ were fabricated by the paste printing method on a Au/Cu/Ni/Al UBM. The shear strength of the bump, as-reflowed, was 650 gf., and after 1000hrs aging the shear strength decreased 18%. These values are comparable or higher relative to those of Sn37Pb and Sn3.5Ag0.7Cu alloy. Micro-structure and thermal cycle test in the range of +125°C/-40°C were carried out to estimate reliability.