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Session 11: Pb-Free Solders II
Location: C 215 (Greater Columbus Convention Center)
(Please check final room assignments on-site).
Session Description: This session will highlight advances in Pb-free solders

Editor:Dr. T. J. Lienert Los Alamos National Laboratory, Los Alamos, NM
Session Chairs:Prof Kojiro F. Kobayashi Osaka University, Osaka, Japan
Prof Jae Pil Jung University of Seoul, Seoul, South Korea
2:00 PMJOI 11.1Evaluation of the Solderability and Joint Properties of a New Sn-Cu-Bi-In Solder
2:30 PMJOI 11.2Lead-Free Soldering of a Hybrid Microcircuit Package Assembly – A University/Industry Design Project Collaboration
3:00 PMJOI 11.3Effect of Ni Addition on Interfacial Reaction Between Sn-Cu Solder and Cu Base Metal
3:30 PMJOI 11.4Microstructural Characterization of Tin-Silver Eutectic Solder Alloyed with Small Concentration of Lead
4:00 PMJOI 11.5Effect of Au Coating Thickness on Interfacial Reaction and Joint Strength of Sn-Ag Based Solders Reflowed on Electroless Ni-P/Au Plated Cu Land
4:30 PMJOI 11.6Selecting Cluster Model in Sn-based Solder Alloy Design with DV- Xa Calculation Method