T. Frech, K. Fenner, EWI, Columbus, OH
Hole drilling with lasers is a well-understood technology for hole size greater than 50 microns. However, laser drilling of smaller holes is more difficult because of inconsistent hole sizes and shapes. A greater understanding of this effect has been obtained. Surface modification (dimpling) can be controlled for small features and has potential for applications in tribology and medical devices. Micro-welding applications for MEMS were also explored.
Summary: Hole drilling with lasers is a well-understood technology for hole size greater than 50 microns. However, laser drilling of smaller holes is more difficult because of inconsistent hole sizes and shapes. A greater understanding of this effect has been obtained. Surface modification (dimpling) can be controlled for small features and has potential for applications in tribology and medical devices. Micro-welding applications for MEMS were also explored.
