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Session 4: Microjoining I
Location: C 216 (Greater Columbus Convention Center)
(Please check final room assignments on-site).
Session Description: This session will highlight advances in microjoining
Editor:	Dr. T. J. Lienert Los Alamos National Laboratory, Los Alamos, NM
Session Chairs:	Y. Zhou University of Waterloo, Waterloo, ON, Canada Mr. Peter C. Hall Edison Welding Institute, Columbus, OH
8:30 AM	JOI 4.1		Micro Electron Beam Welding in an SEM
9:00 AM	JOI 4.2		Nd-YAG Laser Micro Welding of Ti-Ni Type Shape Memory Alloy Wire and its Corrosion Resistance
9:30 AM	JOI 4.3		Micro-Laser Processing: Surface Modification and Welding of Features Less than 50 Microns
10:00 AM	JOI 4.4		Analysis of Stress Relaxation Characteristic of Chilled Eutectic Sn-Pb Solder
10:30 AM	JOI 4.5		The Effect of Surface Tension on Microjoining
11:00 AM	JOI 4.6		A Review of Microjoing Technology in Harbin Institute of Technology, China