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Monday, October 18, 2004 - 2:30 PM
FRO 3.2

INVITED: Process Development and Micro/Nano Fabrication of Piezoelectric Based MEMS and NEMS Devices

R. G. Polcawich, US Army Research Laboratory, Adelphi, MD

During recent years, the research of micro and nano electromechanical systems (MEMS & NEMS) has demonstrated significant advances in miniaturized mechanical devices based on thin films and silicon technology. This technology has led to vast improvements in a multitude of applications. MEMS devices have revolutionized the airbag sensors within automobiles. Miniaturization has resulted in higher precision and stability in micropositioners used in atomic force microscopes, scanning probe microscopes, and hard disk drives. In a vast majority of the research ongoing on MEMS & NEMS devices, materials are limited to those readily available during the fabrication of microelectronic integrated circuits (IC). The advantages to this strategy are numerous including the wealth of processing knowledge available on the standard IC materials and existing fabrication facilities for the manufacturing of devices. However, this strategy can limit the physical phenomena that can be exploited for the miniaturization of sensors and actuators.Piezoelectricity is one phenomenon that has been under-investigated within the MEMS and NEMS communities. Although there has been growing interest in the use of ZnO and AlN piezoelectrics, there still exists a void in the research of ferroelectrics, or polar materials. Even with substantially higher piezoelectric coefficients, ferroelectrics such as lead zirconate titanate, PZT, have been under utilized in the development of MEMS and NEMS devices. Besides the contamination concerns that arise with introducing lead into the fabrication facility, other limiting factors include high processing temperatures, residual stress, materials that can be difficult to etch, and reliability of the devices created with new materials.The research being done at the Army Research Laboratory attempts to solve the common issues associated with processing of piezoelectric MEMS & NEMS.