As integrated-circuit technologies have scaled down to sub-100 nm range, its desirable performance cannot be accomplished without incorporating high-performance electronic interconnects that utilize various types of metallic and dielectric films. The useful life of an ultra-fine electronic circuit is largely limited by functional, structural, and mechanical reliability of the interconnects. Achieving this reliability has become increasingly challenging, primarily, due to revolutionary changes in materials and ever complex thin-film processes. This presentation will cover how thin-film science and engineering of electronic interconnects can be applied to manufacture reliable electronic circuits. In particular, this presentation will address how to solve several outstanding reliability issues from the surface/interface engineering, failure mechanism, metallization architecture, and interconnect design-rule perspectives.