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Session 6: Pb-Free Solders I
Location: C 216 (Greater Columbus Convention Center)
(Please check final room assignments on-site).
Session Description: This session will highlight advances in Pb-free solders
Editor:	Dr. T. J. Lienert Los Alamos National Laboratory, Los Alamos, NM
Session Chair:	Mr. Mike Powers Agilent Technologies, Inc., Santa Rosa, CA
2:00 PM	JOI 6.1		Interfacial Reaction Between Sn8Zn3Bi and NiAu Plating
2:30 PM	JOI 6.2		Room Temperature Lead-Free Soldering of Microelectronic Components using a Local Heat Source
3:00 PM	JOI 6.3		Nanoindentation of Intermetallics Formed in Pb-free Solder Joints: Experiments and Simulation
3:30 PM	JOI 6.4		Pb Free, Active Solder Joining for Electronic Packing and Thermal Management Applications
4:00 PM	JOI 6.5		Study for Increasing in the Melting Temperature of Micro Joint using Sn-Ag Solder and Au/Ni-Co Plating
4:30 PM	JOI 6.6		Microstructural Characterization of Eutectic Tin-Gold Solder as a Lead-Free Solution