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| Session 9: Microjoining II | ||||
| Location: C 215 (Greater Columbus Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: This session will highlight advances in microjoining | ||||
| Editor: | Dr. T. J. Lienert Los Alamos National Laboratory, Los Alamos, NM | |||
| Session Chairs: | Dr. G.A. Knorovsky Sandia National Laboratories, Albuquerque, NM Chunqing Wang Harbin Institute of Technology, Harbin, China | |||
| 9:00 AM | JOI 9.1 | Effects of Surface Microstructure of Copper on Surface Energy after Pulse Nd:YAG Laser Irradiation | ||
| 9:30 AM | JOI 9.2 | Welding Nitinol to Stainless Steel | ||
| 10:00 AM | JOI 9.3 | Damage Control of Soldering Iron Tip for Lead-Free Solder | ||
| 10:30 AM | JOI 9.4 | Resistance Microwelding of Fine Nickel Wires | ||
| 11:00 AM | JOI 9.5 | Novel Bonding Process Using Ag Nanoparticles-Influence of Bonding Conditions | ||