Enhanced thermal conductivity of NiTi alloys through Cu reinforcement
Nickel–titanium (NiTi) alloys are widely studied for their exceptional shape memory effect, superelasticity, and biocompatibility, which make them highly attractive for applications in biomedical devices, aerospace components, and smart actuators. However, the relatively low thermal conductivity of NiTi alloys remains a critical limitation, particularly in high-performance applications where efficient and rapid heat transfer is essential. This study investigates the enhancement of thermal conductivity in Ni-rich NiTi alloys through controlled copper (Cu) reinforcement, employing a powder metallurgy route coupled with sintering for densification while retaining the desirable mechanical properties.
NiTi–xCu (x = 1–5 wt%) composites will be synthesized from elemental powders and characterized to assess the influence of Cu addition on microstructure and thermal transport behaviour. X-ray diffraction (XRD) and scanning electron microscopy (SEM) will be utilised to study Cu distribution and partial substitution of Ni within the B2 austenitic matrix. Laser flash analysis will be used to evaluate resulting thermal conductivity in comparison to unmodified NiTi—while verifying preservation of shape memory transformation characteristics and mechanical integrity. Beyond performance enhancement, this improvement in thermal conductivity will contribute to broader implications for sustainability and energy efficiency.
These findings would demonstrate that Cu reinforcement offers a practical route to tailor the thermal transport properties of NiTi-based SMAs without compromising functionality. The improved thermal response can help broaden the potential of NiTi materials for high-frequency actuators, thermally cycled sensors, and heat-regulating smart structures.
Keywords: NiTi alloy, copper reinforcement, thermal conductivity, powder metallurgy, sintering, shape memory alloys, smart materials.