Linking Target Microstructure with its Sputter Performance

Sputtering targets can be manufactured by various processes, including melting & casting, or powder metallurgy. The manufacturing route governs the microstructure of the target material, which is mainly characterized by the density, grain size, and the crystallites’ orientation distribution (texture).

It is commonly understood that the performance of a sputter target utilized in a magnetron sputter coater heavily depends on its microstructure. The impact of the target microstructure on PVD process parameters like deposition rate, arc frequency or target voltage were investigated for various Molybdenum- and Mo-based alloys for planar cathodes in a DC discharge.