Linearized Hollow Cathode Plasma for PECVD

Scientists and Engineers at AGC/Interpane have developed a novel plasma generation system and industrialized the devices for Plasma-Enhanced Chemical Vapor Deposition [PECVD] coatings on substrates up to jumbo sized glass (3.2m x 6.0m).

Plasma generation is accomplished between multiple linear hollow cathodes, alternately driven by mid-frequency AC or pulsed power.  Extremely high input power densities of 40-80 kW per meter of plasma length are achievable with robust electrode designs and a plasma generation mechanism which does not require magnets in the plasma source.

Stable plasmas can be maintained using a variety of input gases, such as Oxygen, Nitrogen, Argon, Helium, and Hydrogen.  

Depending upon the choice of precursor materials and the desired film properties, dynamic deposition rates for inline coatings of 200-500 nm*m/min have be achieved for SiO₂.

Plasma operation is possible in an extremely wide range of pressures from 1 mTorr to 1 Torr, while the most useful process pressures for PECVD are generally in the 1 mTorr to 30 mTorr range.  Hollow Cathode PECVD pressures are compatible with conventional Physical Vapor Deposition [PVD] pressures to allow for the deposition of multi-layer coating stacks by PVD and PECVD in an inline coating system.