Low Temperature Plasma-Assisted Atomic Layer Epitaxy of III-V Nitride Semiconductors
Atomic layer deposition (ALD) is a pulsed growth method in which the precursors for growth are introduced in a sequence of gas pulses on top of an inert carrier gas flow. ALE is simply ALD at temperatures that are sufficient to promote surface diffusion processes that allow either homo- or hetero-epitaxial growth. With proper surface preparations, high quality, wurtzitic AlN is grown at 500 °C [1]. These thin films (~36 nm) demonstrated smooth surfaces (~0.7 nm rms roughness for 10x10 mm2 scan area) and a (0002) peak rocking curve of width 670 arc-sec. Similar results are demonstrated for GaN films grown between 350 and 450°C. For InN, two growth regimes were defined. One between 175 and 185°C, in which a new cubic phase of InN was realized, and a second regime between 220 and 260°C for which quality wurtzitic materials were grown [2]. Finally, III-V nitride ternaries (InAlN, InGaN and AlGaN) were grown over a wide stoichiometric range including the range where phase separation has been an issue for molecular beam epitaxy and chemical vapor deposition [3]. These ALE ternary layers were used to synthesize III-V nitride based device structures on GaN and demonstrated 2DEG at the interface. These early results suggest great potential for ALE growth of III-N semiconductors, which can be used to design and grow different novel materials.