High Power Impulse Magnetron Sputtering (HIPIMS) II

Thursday, May 4, 2017: 11:00 AM-12:40 PM
553AB (Rhode Island Convention Center)
Ju Liang He, Feng Chia University and Arutiun P. Ehiasarian, PhD, FInstP, Sheffield Hallam University
11:00 AM
Upscaling challenges of HIPIMS for directional deposition
Juergen Weichart, Evatec AG; Kay Viehweger, Fraunhofer IZM ASSID
11:20 AM
Process transfer from R&D to small industrial cathode
Ralf Bandorf, Fraunhofer IST; Dominic Spreemann, Fraunhofer IST; Holger Gerdes, Fraunhofer IST; Michael Vergöhl, Fraunhofer IST; Günter Bräuer, Fraunhofer IST
11:40 AM
Temporal evolution of Ti sputtered species number densities in multi-pulse HiPIMS process
Matej Fekete, Masaryk University; Jaroslav Hnilica, Masaryk University; Petr Vašina, Masaryk University
12:00 PM
Optimization of Voltage Pulse for Higher Deposition Rate in High Power Impluse Magnetron Sputtering (HiPIMS)
Xiubo Tian, State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology; Chunzhi Gong, State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology; Xuesong Wang, State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology; Dmitriy Golosov, Belarussian State University of Informatics and Radioelectronics
12:20 PM
Deposition of Titanium Oxide Films by Current-Controlled High Power Impulse Magnetron Sputtering
Arutiun P. Ehiasarian, PhD, FInstP, Sheffield Hallam University; Papken Eh. Hovsepian, PhD, FInstP, Sheffield Hallam University; Daniel A. Loch, PhD, Sheffield Hallam University; Joerg Neidhardt, PhD, Von Ardenne GmbH; Andreas Heisig, Von Ardenne GmbH
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