Microelectronic Yield Characterization
Invited EDFAS Tutorial
for IMAT 2022
ABSTRACT
Failure Analysis is performed on many different materials and across many different industries. One such industry is Microelectronic Devices. While the Failure Analysis tools used overlap a lot of other industries (SEM, FIB, TEM, etc.), the functionality of Microelectronic Devices differ enough for there to be a specific ASM affiliate, Electronic Device Failure Analysis Society (EDFAS). This tutorial is based on the tutorial presented yearly at EDFAS’ conference, International Symposium for Testing and Failure Analysis (ISTFA).
Microelectronic Yield Characterization is an overview tutorial which helps the failure analyst understand the importance of their work, and the work involved by others prior to a sample being submitted for Failure Analysis. In general, for Microelectronic Devices, the failure is electrical in nature; however, the analysis results are physical in nature (ie. materials or structural). This tutorial covers how the different categories of electrical test and knowledge of the manufacturing processes can be used to solve problems, with little to no hands-on failure analysis. The topics and terminology in this tutorial will equip the failure analyst to better comprehend the range of available analyses, plus communicate better across their technical and business communities. While specifically covering Microelectronic Devices, the concepts and principles can be applicable to other industries where Failure Analysis is performed.