ISTFA Home
Exposition
To Register
ASM Homepage
Back to "Session 5: Package Level Analysis 1" Search
Back to "Symposium" Search
Back to Main Search
Tuesday, November 16, 2004 - 2:45 PM
5.4
Extracting Acoustic signatures of Solder Bump defects using Wavelet Power Spectra and their classification using normalized cross- correlation
K. Ramanujachar
, Intel Corporation, Chandler, AZ
View in WORD format