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| Session 5: Package Level Analysis 1 | ||||
| Location: South Ballroom (Worcester's Centrum Centre) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: Package level analysis is accomplished using an assortment of novel techniques and tools. Presentations in session 1 will focus on a few of these tools such as SQUID, Acoustic Microscopy and X-ray techniques, as these are at the forefront of tools used for identifying specific package level defect mechanisms. | ||||
| Editors: | Mr. Ted Hasegawa National Semiconductor, Santa Clara, CA Felix Beaudoin IBM Mr. Michael Eskenazi Qualcomm Corporation, San Diego, CA Mr. Stanley Swieck Analog Devices, Wilmington, MA James Cargo Agere Systems, Allentown, PA Mr. Ray D. Harrison Texas Instruments, Dallas, TX Mr. David Vallett IBM Systems and Technology Group, Essex Jct., VT | |||
| Session Chair: | Mr. Ray Harrison Texas Instruments, Dallas, TX | |||
| 1:30 PM | 5.1 | PLENARY TALK: Scanning Squid Microscopy For New Package Technologies | ||
| 1:55 PM | 5.2 | Failure Analysis of Short Faults on Advanced Wire-bond and Flip-chip Packages with Scanning SQUID Microscopy | ||
| 2:20 PM | 5.3 | A Novel Approach to Identifying and Validating Electrical Leakage in Printed Circuit Boards through Magnetic Current Imaging | ||
| 2:45 PM | 5.4 | Extracting Acoustic signatures of Solder Bump defects using Wavelet Power Spectra and their classification using normalized cross- correlation | ||
| 3:10 PM | 5.5 | A Novel X-ray Microtomography System with High Resolution and Throughput For Non-Destructive 3D Imaging of Advanced Packages | ||
| 3:35 PM | Break | |||