Failure Analysis of Short Faults on Advanced Wire-bond and Flip-chip Packages with Scanning SQUID Microscopy
S. K. Hsiung, K. V. Tan, LSI Logic Corporation, Fremont, CA; A. J. Komrowski, LSI Logic Corp., Fremont, CA; D. J. D. Sullivan, LSI Logic, Fremont, CA; J. Gaudestad, Neocera Inc, Beltsville, MD
