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Wednesday, November 17, 2004 - 12:00 AM
P12

Sample Preparation and Preservation for TEM Analysis of Copper Interconnect Integrated Circuit

Q. Gao, Semiconductor Manufacturing International Corporation, Shanghai, China; M. Zhang, Semiconductor Manufacturing International Corperation, Shanghai, China; C. Niou, Semiconductor Manufacturing International (Beijing) Corp, Beijing, China; M. Li, Semicoductor Manufacturing International Co., Shanghai, China; W. T. K. Chien, Semiconductor Manufacturing International Company, Shanghai, China

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