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Tuesday, November 16, 2004 - 1:55 PM
6.2

PLENARY TALK: Cavity Up and Stack Die Backside FA for Thin Die and High Pin Count Devices

D. T. Nguyen, Texas Intruments, Inc., Dallas, TX; T. To, Texas Instruments Inc., Dallas, TX; R. Harrison, Texas Instruments, Dallas, TX; C. Phan, J. Drummond, Texas Intruments Corp, Dallas, TX

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