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Wednesday, November 17, 2004 - 2:10 PM
14.2
Measurement of Solder Joint Strength and its Dependence on Thermal Aging in Freestanding and Board-Mounted Packages Using a Laser Spallation Technique
V. Gupta, J. Tian, UCLA, Los Angeles, CA; C. Hartfield, Omniprobe, Inc., Dallas, TX; K. Zeng, C. Cheng, TI, Dallas, TX
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