ISTFA Home
Exposition
To Register
ASM Homepage
Back to "Poster" Search
Back to "Symposium" Search
Back to Main Search
Wednesday, November 17, 2004 - 12:50 AM
P7
Failure analysis of broken stitch bonds in TSSOP packages using Scanning Acoustic Microscopy (SAM) and Time Domain Reflectometry (TDR)
C. Lewis, B. Abd-AlRahman, T. Simons, Texas Instruments, Dallas, TX
View in WORD format