ISTFA Home
Exposition
To Register
ASM Homepage
Back to "Session 17: SPM Techniques 2" Search
Back to "Symposium" Search
Back to Main Search
Thursday, November 18, 2004 - 9:40 AM
17.5
Characterization of Interconnect Defects using Scanning Thermal Conductivity Microscopy
H. Ho, J. Phang, National University of Singapore, Singapore, Singapore; A. Altes, L. Balk, Bergische Universität Wuppertal, Wuppertal, Germany
View in PDF format
