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| Session 17: SPM Techniques 2 | ||||
| Location: South Ballroom (Worcester's Centrum Centre) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: The SPM methods and measurements possible for the analytical laboratory are truly impressive! This session will contain 5 papers, each with an example of a different technique and its experimental methods. One talk will present a novel SCM sample prep technique with FIB mill. 3 talks will detail use of Magnetic Force Microscopy current measurements, thermal conductivity microscopy subsurface metal void isolation, and doping profiling with Scanning Spreading Resistance. A final talk will discuss the current limits of resolution possible with AFM/SPM. | ||||
| Editors: | Mr. Ted Hasegawa National Semiconductor, Santa Clara, CA Felix Beaudoin IBM Mr. Michael Eskenazi Qualcomm Corporation, San Diego, CA Mr. Stanley Swieck Analog Devices, Wilmington, MA James Cargo Agere Systems, Allentown, PA Mr. Andy Erickson Multiprobe, Inc., Santa Barbara, CA Mr. David Vallett IBM Systems and Technology Group, Essex Jct., VT | |||
| Session Chair: | Mr. Andy Erickson Multiprobe, Inc., Santa Barbara, CA | |||
| 8:00 AM | 17.1 | Doping mapping by SSRM – reaching maturity and sub-10nm resolution | ||
| 8:25 AM | 17.2 | Investigation of Low-Energy Focused Ion Beam Milling for Scanning Capacitance Microscopy Sample Preparation | ||
| 8:50 AM | 17.3 | Study of MFM Application in Semiconductor Failure Analysis | ||
| 9:15 AM | 17.4 | Sampling and Reference Considerations for Very High Resolution AFM Analysis | ||
| 9:40 AM | 17.5 | Characterization of Interconnect Defects using Scanning Thermal Conductivity Microscopy | ||
| 10:05 AM | Break | |||