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Sunday, November 14, 2004 - 1:15 PM

Materials Characterization for Failure Analysis

L. Wagner, Texas Instruments, Dallas, TX

Note this is an abstract for a Seminar not the Symposium

Chemical analysis plays a key role in the identification of defects is a critical part of the diagnostic flow for IC’s. This seminar will cover the key techniques commonly used in the analysis of IC. It will cover the physical basis of the approach, limitations and advantages and typical applications for each technique. The core method for analysis in failure analysis is energy dispersive analysis which provides a balance of the primary desired properties, sensitivity, spatial resolution and easy of analysis. Other techniques which fill key gaps for energy dispersive analysis will also be discussed including Auger Analysis, Secondary Ion Mass Spectrometry, Fourier Transform Infrared and others.