This course focuses on techniques that can be used for analysis, reliability testing, and failure analysis of MEMS. Because many failure modes encountered in MEMS – such as stiction, creep, and fracture – are not found in IC’s, different failure analysis and testing techniques are required. Special attention is given in the course to these techniques, which are specially developed for MEMS, such as optical techniques for motion analysis and profilometry. Existing techniques that were adapted are used in an alternative way for reliability studies, and failure analysis will also be presented. Each technique will be explained in sufficient detail for the new user to understand the basic mechanisms and the application field.