In this tutorial, optoelectronic techniques for the noninvasive, quantitative, and full-field of view measurement of shape and changes in states of deformation of MEMS and electronic packages are presented. Shape and changes in states of deformation are directly related to the functionality, performance, and integrity of components of interest. With optoelectronic techniques it is possible to characterize, with nanometer measuring accuracy, MEMS and electronic packages subjected to actual operating and loading conditions. Topics covered include, but are not limited to, laser and white light interferometry, Moiré, digital holography, holographic microscopy, and confocal microscopy techniques. Tour of the CHSLT-NEST facilities, scheduled as part of the ISTFA 2004 Conference, will illustrate application of optoelectronic techniques to perform NDT and characterization of MEMS and electronic packages.