K. S. Wills, Independent Consultant, Sugar Land, TX; S. Perungulam, Texas Instruments, Stafford,, TX
Physical access to the semiconductor device is vital to failsite isolation. Presented here will be techniques for gaining access to the device. The techniques will cover mechanical, dry, and wet de-capsulation. For flip chip devices, delidding and lapping procedures are described for the purpose of backside analysis.