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| Session 12: MEMS | ||||
| Location: South Ballroom (Worcester's Centrum Centre) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: The microelectromechanical systems (MEMS) session focuses on failure mechanisms found in MEMS devices and their packaging. The topics discussed include case studies of failed MEMS, test methodology and test structures, sample preparation, theory on failure modes, packaging related issues and specific techniques for MEMS failure analysis. | ||||
| Editors: | Dr. Ingrid De Wolf IMEC, Leuven, Belgium Mr. Jeremy A. Walraven Sandia National Labs, Albuquerque, NM James Cargo Agere Systems, Allentown, PA Mr. Stanley Swieck Analog Devices, Wilmington, MA Mr. Michael Eskenazi Qualcomm Corporation, San Diego, CA Felix Beaudoin IBM Mr. Ted Hasegawa National Semiconductor, Santa Clara, CA Mr. David Vallett IBM Systems and Technology Group, Essex Jct., VT | |||
| Session Chair: | Dr. Ingrid De Wolf IMEC, Leuven, Belgium | |||
| 9:35 AM | 12.1 | Quantifying the work of adhesion between an AFM cantilever tip and MEMS test structures after packaging | ||
| 10:00 AM | 12.2 | Reliability of Polycrystalline MEMS : prediction of the debugging-time | ||
| 10:25 AM | 12.3 | Failure Analysis of Electrothermal Actuators Subjected to Electrical Overstress (EOS) and Electrostatic Discharge (ESD) | ||
| 10:50 AM | 12.4 | Detecting the 10 Angstroms That Change MEMS Performance | ||
| 11:15 AM | Awards Luncheon/Posters | |||