Failure analysis of surface mount technology assemblies on printed circuit boards with CPU sockets, BGA packages and various passive components will be discussed in case study format. This tutorial provides a comprehensive overview of failure modes and mechanisms observed at the second level interconnect between PCB platforms and components assembled using advanced lead-free SMT manufacturing technology. A brief introduction to the methodology of the non-destructive to destructive failure analysis approach and the associated tools and techniques developed for each case study will also be described. Learning objectives include an introduction to the methodology of failure analysis of SMT/PCB assemblies; micro and macro analytical tools and techniques; and selected case studies of failure modes and mechanisms.