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| Packaging 2 | ||||
| Location: Meeting Room J2 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Editor: | Mr. Jeremy A. Walraven Sandia National Labs, Albuquerque, NM | |||
| Session Chair: | Ms. Becky Holdford Texas Instruments, Dallas, TX | |||
| 8:00 AM | GEN0510.1 | Advanced PCB and SMT Assembly Failure Modes and Mechanisms | ||
| 10:00 AM | Break | |||
| 10:15 AM | System Level ESD Testing Using the Transmission Line Pulse (TLP) Methodology | |||