Backside analysis, in many varied manners, has been under development as a useful tool for quite some time. The very nature of this method of analysis, used for debug and fault isolation, requires a stretch of the imagination and creative solutions for which we see no limits. The procedures used to gain access to the back of the target die for techniques such as Photon-Emission Microscopy have created many unique and challenging solutions of their own. In this discussion, “Repackaging” the device into a configuration allowing access to the target die while maintaining identical electrical characteristics will be considered. The use and successful implementation of the described method has given us a new tool for solving some very complex and troublesome engineering problems.