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| Packaging 1 | ||||
| Location: Meeting Room J3 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Editor: | Mr. Jeremy A. Walraven Sandia National Labs, Albuquerque, NM | |||
| Session Chairs: | Ms. Becky Holdford Texas Instruments, Dallas, TX Mr. Kendall Scott Wills Independent Consultant, Sugar Land, TX | |||
| 8:15 AM | GEN059.1 | Chip Scale Packages and its Failure Analysis Challenges | ||
| 9:00 AM | GEN059.2 | X-Ray & SAM Challenges for IC Package Inspection | ||
| 9:45 AM | GEN059.3 | Fault Isolation in Electronic Packaging and On-Chip Using Time Domain Reflectometry | ||
| 10:30 AM | GEN059.4 | Stacked Die and Repackaging for Failure Analysis | ||