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Tuesday, November 8, 2005 - 3:00 PM
SYMP057.3

Contacting Diffusion with FIB for Backside Circuit Edit - Procedures and Material Analysis

U. Kerst, P. Sadewater, R. Schlangen, C. Boit, TUB Berlin University of Technology, Berlin, Germany; R. Leihkauf, Hahn Meitner Institut, Berlin, Germany; B. Simmnacher, Infineon Technologies AG, Munich, Germany; T. R. Lundquist, DCG Systems, Inc, Freemont, CA; E. LeRoy, Credence Systems Corporation, Sunnyvale, CA

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