Contacting Diffusion with FIB for Backside Circuit Edit - Procedures and Material Analysis
U. Kerst, P. Sadewater, R. Schlangen, C. Boit, TUB Berlin University of Technology, Berlin, Germany; R. Leihkauf, Hahn Meitner Institut, Berlin, Germany; B. Simmnacher, Infineon Technologies AG, Munich, Germany; T. R. Lundquist, DCG Systems, Inc, Freemont, CA; E. LeRoy, Credence Systems Corporation, Sunnyvale, CA
